Invention Grant
- Patent Title: Integrated circuit and method of manufacturing an integrated circuit
- Patent Title (中): 集成电路和集成电路制造方法
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Application No.: US14043971Application Date: 2013-10-02
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Publication No.: US09306058B2Publication Date: 2016-04-05
- Inventor: Martin Vielemeyer , Andreas Meiser , Till Schloesser , Franz Hirler , Martin Poelzl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66

Abstract:
An integrated circuit includes a transistor in a semiconductor substrate having a main surface. The transistor includes a source region, a drain region, a channel region, a drift zone, a gate electrode, and a gate dielectric adjacent to the gate electrode. The gate electrode is disposed adjacent to at least two sides of the channel region. The channel region and the drift zone are disposed along a first direction parallel to the main surface between the source region and the drain region. The gate dielectric has a thickness that varies at different positions of the gate electrode.
Public/Granted literature
- US20150091088A1 Integrated Circuit and Method of Manufacturing an Integrated Circuit Public/Granted day:2015-04-02
Information query
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