Invention Grant
US09307628B2 Circuit board assembly using metal plates as conducting medium embedded therein
有权
使用金属板作为导电介质嵌入其中的电路板组件
- Patent Title: Circuit board assembly using metal plates as conducting medium embedded therein
- Patent Title (中): 使用金属板作为导电介质嵌入其中的电路板组件
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Application No.: US13868575Application Date: 2013-04-23
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Publication No.: US09307628B2Publication Date: 2016-04-05
- Inventor: Chun-Chin Shin
- Applicant: KING SHING INDUSTRIAL CO., LTD.
- Applicant Address: TW Taoyuan County
- Assignee: KING SHING INDUSTRIAL CO., LTD.
- Current Assignee: KING SHING INDUSTRIAL CO., LTD.
- Current Assignee Address: TW Taoyuan County
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: TW102105650A 20130218
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/03 ; H05K1/16 ; B23P19/00 ; H05K1/02 ; H05K1/18 ; H05K3/20 ; G06F1/20 ; H05K1/14
Abstract:
A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.
Public/Granted literature
- US20140233189A1 CIRCUIT BOARD ASSEMBLY USING METAL PLATES AS CONDUCTING MEDIUM EMBEDDED THEREIN Public/Granted day:2014-08-21
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