Invention Grant
- Patent Title: Hinge assembly for electronic device
- Patent Title (中): 电子装置铰链总成
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Application No.: US14142802Application Date: 2013-12-28
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Publication No.: US09309707B2Publication Date: 2016-04-12
- Inventor: Jered H. Wikander , Nathaniel B. Osterberg , Douglas Heymann , Shawn S. Mceuen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: E05D7/00
- IPC: E05D7/00 ; E05D3/06 ; G06F1/16

Abstract:
In one embodiment a hinge assembly comprises a first hinge pin rotatable about a first axis, a first gear coupled to the first hinge pin and rotatable about the first axis, a second hinge pin rotatable about a second axis substantially parallel to the first axis, a second gear coupled to the second hinge pin and rotatable about the second axis, at least one connecting member to be coupled to the first hinge pin and the second hinge pin to hold the first hinge pin at a fixed distance from the second hinge pin such that the first gear is engaged with the second gear. At least one of the first gear or the second gear comprises a variable radius. Other embodiments may be described.
Public/Granted literature
- US20150184437A1 HINGE ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2015-07-02
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