Invention Grant
US09314986B2 Method and system for applying an adaptive perforation cut to a substrate
有权
将自适应穿孔切割应用于基底的方法和系统
- Patent Title: Method and system for applying an adaptive perforation cut to a substrate
- Patent Title (中): 将自适应穿孔切割应用于基底的方法和系统
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Application No.: US13664759Application Date: 2012-10-31
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Publication No.: US09314986B2Publication Date: 2016-04-19
- Inventor: Stephen C. Morgana , Reiner Eschbach
- Applicant: Xerox Corporation
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Fox Rothschild LLP
- Main IPC: B31B1/00
- IPC: B31B1/00 ; B26D5/34

Abstract:
A method and system automatically and dynamically updates the design of perforation lines in a package design file. It identifies an edge between two facets to which a perforation line is to be applied, determines a length of the edge, and uses the length of the edge and a default cut segment length to determine a number of cut segments that will be included in the perforation line. The method and system also may determine a phasing for the perforation line to ensure that the ends of the line are either a cut or spacer, depending on the desired function or placement of the line.
Public/Granted literature
- US20140121800A1 METHOD AND SYSTEM FOR APPLYING AN ADAPTIVE PERFORATION CUT TO A SUBSTRATE Public/Granted day:2014-05-01
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