Invention Grant
- Patent Title: Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit
- Patent Title (中): 集成电路加热器，用于减少集成电路材料中的应力和集成电路的芯片引线，并优化集成电路器件的性能
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Application No.: US14496870Application Date: 2014-09-25
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Publication No.: US09318409B1Publication Date: 2016-04-19
- Inventor: Douglas M. Reber , Mehul D. Shroff , Edward O. Travis
- Applicant: Douglas M. Reber , Mehul D. Shroff , Edward O. Travis
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/34
Abstract:
A device comprising a first detector, comprising an output, disposed at a first location of an integrated circuit chip and configured to determine a first temperature information, a chip heater, comprising an input to receive a control signal, disposed at a second location of the integrated circuit and configured to heat an area of the integrated circuit device that includes the first location and the second location, based upon the control signal, and a heater controller comprising a first input coupled to the output of the first detector to receive the first temperature information, and an output coupled to the input of the chip heater, the heater controller configured to generate the control signal based upon the first temperature information.
Public/Granted literature
Information query
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