Invention Grant
US09318564B2 High density static random access memory array having advanced metal patterning
有权
具有先进金属图案化的高密度静态随机存取存储器阵列
- Patent Title: High density static random access memory array having advanced metal patterning
- Patent Title (中): 具有先进金属图案化的高密度静态随机存取存储器阵列
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Application No.: US14281710Application Date: 2014-05-19
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Publication No.: US09318564B2Publication Date: 2016-04-19
- Inventor: Niladri Mojumder , Stanley Seungchul Song , Zhongze Wang , Choh Fei Yeap
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/40 ; H01L29/161 ; H01L27/02 ; H01L27/11

Abstract:
Methods and apparatus directed toward a high density static random access memory (SRAM) array having advanced metal patterning are provided. In an example, provided is a method for fabricating an SRAM. The method includes forming, using a self-aligning double patterning (SADP) technique, a plurality of substantially parallel first metal lines oriented in a first direction in a first layer. The method also includes etching the substantially parallel first metal lines, using a cut mask, in a second direction substantially perpendicular to the first direction, to separate the substantially parallel first metal lines into a plurality of islands having first respective sides that are aligned in the first direction and second respective sides that are aligned the second direction. The method also includes forming, in a second layer, a plurality of second metal lines oriented in the first direction.
Public/Granted literature
- US20150333131A1 HIGH DENSITY STATIC RANDOM ACCESS MEMORY ARRAY HAVING ADVANCED METAL PATTERNING Public/Granted day:2015-11-19
Information query
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