发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US14357669申请日： 2012-02-14
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公开(公告)号： US09324630B2公开(公告)日： 2016-04-26
- 发明人: Noboru Miyamoto , Masao Kikuchi
- 申请人： Noboru Miyamoto , Masao Kikuchi
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人： MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Studebaker & Brackett PC
- 国际申请： PCT/JP2012/053375 WO 20120214
- 国际公布： WO2013/121521 WO 20130822
- 主分类号： H01L23/473
- IPC分类号： H01L23/473 ; H01L23/36 ; H01L23/433 ; H01L23/495 ; H01L23/29 ; H01L23/40 ; H01L23/31
摘要：
A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.
公开/授权文献
- US20150108629A1 SEMICONDUCTOR DEVICE 公开/授权日：2015-04-23
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