Invention Grant
- Patent Title: Electronic device comprising an improved lead frame
- Patent Title (中): 电子设备包括改进的引线框架
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Application No.: US14744766Application Date: 2015-06-19
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Publication No.: US09324639B2Publication Date: 2016-04-26
- Inventor: Pierangelo Magni , Roberto Rossi
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Gardere Wynne Sewell LLP
- Priority: ITMI2014A1213 20140703
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K5/02 ; H01L21/00 ; H01L21/48 ; H01L23/48 ; H01L23/00
Abstract:
An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.
Public/Granted literature
- US20160005678A1 ELECTRONIC DEVICE COMPRISING AN IMPROVED LEAD FRAME Public/Granted day:2016-01-07
Information query
IPC分类:
