公开(公告)号：US20160005678A1

公开(公告)日：2016-01-07

申请号：US14744766

申请日：2015-06-19

Applicant: STMicroelectronics S.r.l.

Inventor： Pierangelo Magni ,  Roberto Rossi

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49527 ,  H01L21/4825 ,  H01L23/481 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.

Abstract translation: 电子设备包括芯片和支撑芯片的支撑元件。 引线被提供以电耦合到芯片的至少一个端子。 耦合元件安装到不被芯片占据的支撑元件的自由区域。 耦合元件包括电连接到芯片的至少一个引线和至少一个端子的导电部分，以获得电耦合。

公开(公告)号：US09324639B2

公开(公告)日：2016-04-26

申请号：US14744766

申请日：2015-06-19

Applicant: STMicroelectronics S.r.l.

Inventor： Pierangelo Magni ,  Roberto Rossi

IPC: H01L23/495 ,  H05K5/02 ,  H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L23/49527 ,  H01L21/4825 ,  H01L23/481 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.

Abstract translation: 电子设备包括芯片和支撑芯片的支撑元件。 引线被提供以电耦合到芯片的至少一个端子。 耦合元件安装到不被芯片占据的支撑元件的自由区域。 耦合元件包括电连接到芯片的至少一个引线和至少一个端子的导电部分，以获得电耦合。