Invention Grant
- Patent Title: Method for manufacturing ceramic electronic component, and ceramic electronic component
- Patent Title (中): 陶瓷电子部件的制造方法和陶瓷电子部件
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Application No.: US14140741Application Date: 2013-12-26
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Publication No.: US09328026B2Publication Date: 2016-05-03
- Inventor: Kenichi Okajima , Daiki Fukunaga , Takayuki Yao , Yasunari Nakamura , Akihiro Shiota
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-288208 20121228; JP2013-206147 20131001
- Main IPC: C04B37/00
- IPC: C04B37/00 ; H01G4/30 ; H01G4/12 ; B32B18/00
Abstract:
A raw ceramic portion is formed on each of first and second lateral surfaces of a raw ceramic body. The raw ceramic portions contain ceramic particles and more of at least one constituent selected from Ba, Mg, Mn, and a rare-earth element between the ceramic particles than the ceramic section of the raw ceramic body in terms of total amount. The raw ceramic body is fired with the raw ceramic portions thereon. In this way, a ceramic electronic component is obtained that has a main body left after the raw ceramic body is fired with the raw ceramic portions thereon.
Public/Granted literature
- US20140185185A1 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT, AND CERAMIC ELECTRONIC COMPONENT Public/Granted day:2014-07-03
Information query
