Invention Grant
- Patent Title: Adhesion promoting layer for composite assemblies
- Patent Title (中): 用于复合组件的粘合促进层
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Application No.: US12598569Application Date: 2007-05-23
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Publication No.: US09328262B2Publication Date: 2016-05-03
- Inventor: Chris Harrington
- Applicant: Chris Harrington
- Applicant Address: GB Duxford
- Assignee: Hexcel Composites Limited
- Current Assignee: Hexcel Composites Limited
- Current Assignee Address: GB Duxford
- Agent W. Mark Bielawski; David J. Oldenkamp
- International Application: PCT/IB2007/001601 WO 20070523
- International Announcement: WO2008/142474 WO 20081127
- Main IPC: C09J5/06
- IPC: C09J5/06 ; C08J3/24
Abstract:
The adhesion between an underlying composite material and its surface finish is increased by including an adhesion promoting layer at the interface where the uncured composite material and the surface finish meet during the lay up of the uncured composite assembly. The adhesion promoting layer includes a cure accelerating agent for the composite material matrix resin.
Public/Granted literature
- US20100068497A1 ADHESION PROMOTING LAYER FOR COMPOSITE ASSEMBLIES Public/Granted day:2010-03-18
Information query
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