Invention Grant
- Patent Title: Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC
- Patent Title (中): 降低高温热固性粘合剂和SMC固化收缩率的方法
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Application No.: US13657245Application Date: 2012-10-22
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Publication No.: US09328266B2Publication Date: 2016-05-03
- Inventor: Sampath K. Vanimisetti , Chen-Shih Wang , Vidyashankar R. Buravalla
- Applicant: GM Global Technology Operations LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations, LLC
- Current Assignee: GM Global Technology Operations, LLC
- Current Assignee Address: US MI Detroit
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: IN757/KOL/2012 20120709
- Main IPC: C08J9/32
- IPC: C08J9/32 ; C09J11/04 ; C08K7/24 ; B29K105/16 ; B29C65/48 ; B29C65/00 ; B29C61/00
Abstract:
A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.
Public/Granted literature
- US20140011016A1 Method for Mitigating Cure Shrinkage in High Temperature-Processed Thermosetting Adhesives and SMC Public/Granted day:2014-01-09
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