发明授权
US09331003B1 Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
有权
具有预成型引线框的集成电路封装系统及其制造方法
- 专利标题： Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof
- 专利标题（中）： 具有预成型引线框的集成电路封装系统及其制造方法
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申请号： US14229538申请日： 2014-03-28
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公开(公告)号： US09331003B1公开(公告)日： 2016-05-03
- 发明人: Zigmund Ramirez Camacho , Bartholomew Liao Chung Foh , Sheila Marie L. Alvarez , Dao Nguyen Phu Cuong , HeeJo Chi
- 申请人： Zigmund Ramirez Camacho , Bartholomew Liao Chung Foh , Sheila Marie L. Alvarez , Dao Nguyen Phu Cuong , HeeJo Chi
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPac Ltd.
- 当前专利权人： STATS ChipPac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L23/495 ; H01L23/31 ; H01L21/48
摘要：
An integrated circuit packaging system, and method of manufacture thereof, includes: lead islands; a pre-molded material surrounding a bottom of the lead islands; a device over a portion of the lead islands and having electrical connections to another portion of the lead islands, the electrical connections over areas of the another portion of the lead islands over areas covered by the pre-molded material; and an encapsulation over the device and the lead islands.
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