An integrated antenna package including a laminated structure and a multi-layered substrate is provided. The laminated structure includes at least a chip embedded therein and at least a plated through-hole structure penetrating the laminated structure. The multi-layered substrate is stacked on the laminated structure. The multi-layered substrate includes at least a metal layer located on one side of the multi-layered substrate away from the laminated structure and the metal layer includes at least an antenna pattern located above the chip. The multi-layered substrate includes at least a plated via and through-hole structure penetrating the multi-layered substrate and electrically connected to the chip, so that the antenna pattern is electrically connect with the chip. Also, the manufacturing method of the integrated antenna package is provided.