公开(公告)号：US20240346351A1

公开(公告)日：2024-10-17

申请号：US18088807

申请日：2022-12-27

Applicant: Industrial Technology Research Institute

Inventor： Chang-Sheng Chen ,  Che-Hao Li ,  Cheng-Hua Tsai ,  Meng-Hsuan Chen ,  Wei Chaun Yu ,  Meng-Sheng Chen

IPC: G06N10/40 ,  H05K1/14 ,  H10N60/81 ,  H10N69/00

CPC classification number: G06N10/40 ,  H05K1/147 ,  H10N60/81 ,  H10N69/00

Abstract: The disclosure provides a quantum device and a microwave device. The quantum device includes a first partition, a second partition, an upper circuit board, a lower circuit board and a flexible circuit. The second partition is arranged below the first partition. The first partition and the second partition are used to define an ultra-low temperature chamber of the quantum device. The upper circuit board, the lower circuit board and the flexible circuit are arranged in the ultra-low temperature chamber. The upper circuit board is disposed on a lower surface of the first partition. The lower circuit board is disposed on an upper surface of the second partition. The flexible circuit is electrically connected between the upper circuit board and the lower circuit board to provide multiple signal paths for mutual signal transmission between the upper circuit board and the lower circuit board.

公开(公告)号：US11973260B2

公开(公告)日：2024-04-30

申请号：US17984214

申请日：2022-11-09

Applicant: Industrial Technology Research Institute

Inventor： Ruo-Lan Chang ,  Mei-Ju Lee ,  Cheng-Hua Tsai ,  Meng-Hsuan Chen ,  Wei-Chung Chen

IPC: H01Q1/12 ,  H01Q1/00 ,  H01Q9/04 ,  H01Q9/06 ,  H01Q19/10

CPC classification number: H01Q1/1285 ,  H01Q1/007 ,  H01Q9/0457 ,  H01Q9/065 ,  H01Q19/10

Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

公开(公告)号：US20230163443A1

公开(公告)日：2023-05-25

申请号：US17984214

申请日：2022-11-09

Applicant: Industrial Technology Research Institute

Inventor： Ruo-Lan Chang ,  Mei-Ju Lee ,  Cheng-Hua Tsai ,  Meng-Hsuan Chen ,  Wei-Chung Chen

IPC: H01Q1/12 ,  H01Q19/10 ,  H01Q9/04

CPC classification number: H01Q1/1285 ,  H01Q19/10 ,  H01Q9/0457

Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

公开(公告)号：US20160172317A1

公开(公告)日：2016-06-16

申请号：US14569791

申请日：2014-12-15

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hua Tsai ,  Shyh-Jong Chung ,  Ching-Kuan Lee

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32104 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.

Abstract translation: 提供一种包括中介层结构，毫米波芯片和基板的集成毫米波芯片封装结构。 插入器结构至少包括天线图案和穿过插入件结构并连接到至少一个天线图案的至少一个电镀通孔结构。 毫米波芯片通过至少镀敷的通孔结构电连接到位于毫米波芯片上方或下方的至少天线图案。

公开(公告)号：US20240120656A1

公开(公告)日：2024-04-11

申请号：US18086672

申请日：2022-12-22

Applicant: Industrial Technology Research Institute

Inventor： Meng-Hsuan Chen ,  Cheng-Hua Tsai ,  Mei-Ju Lee ,  Ruo-Lan Chang ,  Wei-Chung Chen

IPC: H01Q9/04 ,  H01Q1/12 ,  H01Q19/10

CPC classification number: H01Q9/045 ,  H01Q1/1271 ,  H01Q19/10

Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.

公开(公告)号：US09331030B1

公开(公告)日：2016-05-03

申请号：US14569799

申请日：2014-12-15

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hua Tsai ,  Shyh-Jong Chung

IPC: H01L23/66 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L23/66 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/1421 ,  H01L2924/15311

Abstract: An integrated antenna package including a laminated structure and a multi-layered substrate is provided. The laminated structure includes at least a chip embedded therein and at least a plated through-hole structure penetrating the laminated structure. The multi-layered substrate is stacked on the laminated structure. The multi-layered substrate includes at least a metal layer located on one side of the multi-layered substrate away from the laminated structure and the metal layer includes at least an antenna pattern located above the chip. The multi-layered substrate includes at least a plated via and through-hole structure penetrating the multi-layered substrate and electrically connected to the chip, so that the antenna pattern is electrically connect with the chip. Also, the manufacturing method of the integrated antenna package is provided.

Abstract translation: 提供了包括层压结构和多层基板的集成天线封装。 层叠结构至少包括嵌入其中的芯片和至少穿透层叠结构的电镀通孔结构。 多层基板层叠在层叠结构体上。 所述多层基板至少包括位于所述多层基板的远离所述层叠结构的一侧的金属层，所述金属层至少包括位于所述芯片上方的天线图案。 多层基板至少包括穿透多层基板的电镀通孔和通孔结构，并与芯片电连接，使得天线图案与芯片电连接。 此外，提供了集成天线封装的制造方法。

公开(公告)号：US09941226B2

公开(公告)日：2018-04-10

申请号：US14569791

申请日：2014-12-15

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Hua Tsai ,  Shyh-Jong Chung ,  Ching-Kuan Lee

IPC: H01L23/66 ,  H01L25/03 ,  H01L23/552 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32104 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/32237 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.