Invention Grant
- Patent Title: Multi-height FinFETs with coplanar topography background
- Patent Title (中): 具有共面形貌背景的多高度FinFET
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Application No.: US13906428Application Date: 2013-05-31
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Publication No.: US09331201B2Publication Date: 2016-05-03
- Inventor: Kangguo Cheng , Bruce B. Doris , Pouya Hashemi , Ali Khakifirooz , Alexander Reznicek
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L21/8238 ; H01L21/84 ; H01L27/12

Abstract:
A semiconductor structure is provided that has semiconductor fins having variable heights without any undue topography. The semiconductor structure includes a semiconductor substrate having a first semiconductor surface and a second semiconductor surface, wherein the first semiconductor surface is vertically offset and located above the second semiconductor surface. An oxide region is located directly on the first semiconductor surface and/or the second semiconductor surface. A first set of first semiconductor fins having a first height is located above the first semiconductor surface of the semiconductor substrate. A second set of second semiconductor fins having a second height is located above the second semiconductor surface, wherein the second height is different than the first height and wherein each first semiconductor fin and each second semiconductor fin have topmost surfaces which are coplanar with each other.
Public/Granted literature
- US20140353752A1 MULTI-HEIGHT FINFETS WITH COPLANAR TOPOGRAPHY BACKGROUND Public/Granted day:2014-12-04
Information query
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