Invention Grant
- Patent Title: Thermoelectric module with a heat conducting layer and method of manufacturing a thermoelectric module
- Patent Title (中): 具有导热层的热电模块和制造热电模块的方法
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Application No.: US13951694Application Date: 2013-07-26
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Publication No.: US09331257B2Publication Date: 2016-05-03
- Inventor: Horst Poelloth , Andreas Eder , Matthias Linde , Boris Mazar , Sigrid Limbeck , Rolf Brueck
- Applicant: EMITEC GESELLSCHAFT FUER EMISSIONSTECHNOLOGIE MBH , BAYERISCHE MOTOREN WERKE AKTIENGESELLSCHAFT
- Applicant Address: DE Lohmar DE Munich
- Assignee: EMITEC Gesellschaft fuer Emissionstechnologie mbH,Bayerische Motoren Werke Aktiengesellschaft
- Current Assignee: EMITEC Gesellschaft fuer Emissionstechnologie mbH,Bayerische Motoren Werke Aktiengesellschaft
- Current Assignee Address: DE Lohmar DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102011009428 20110126
- Main IPC: H01L35/30
- IPC: H01L35/30 ; B23P15/26 ; F25B21/04
Abstract:
A thermoelectric module includes a cold side, a hot side and thermoelectric elements disposed between the two sides. At least one heat conducting layer is disposed between the thermoelectric elements and at least the cold side or the hot side and the heat conducting layer can be compressed. A method for producing a thermoelectric module having at least one heat conducting layer is also provided.
Public/Granted literature
- US20130305743A1 THERMOELECTRIC MODULE WITH A HEAT CONDUCTING LAYER AND METHOD OF MANUFACTURING A THERMOELECTRIC MODULE Public/Granted day:2013-11-21
Information query
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