Invention Grant
- Patent Title: Composite dilation mode resonators
- Patent Title (中): 复合扩张模式谐振器
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Application No.: US13657653Application Date: 2012-10-22
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Publication No.: US09331666B2Publication Date: 2016-05-03
- Inventor: Chengjie Zuo , Jonghae Kim , Changhan Hobie Yun , Sang-June Park , Philip Jason Stephanou , Chi Shun Lo , Robert Paul Mikulka , Mario Francisco Velez , Ravindra V. Shenoy , Matthew Michael Nowak
- Applicant: QUALCOMM MEMS Technologies, Inc.
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H03H9/02 ; H03H9/205 ; H03H9/24

Abstract:
This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes, one or more second electrodes, and a transduction layer arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component along the plane of the x axis and they axis.
Public/Granted literature
- US20140111064A1 COMPOSITE DILATION MODE RESONATORS Public/Granted day:2014-04-24
Information query
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