Invention Grant
- Patent Title: Interconnect architecture with stacked flex cable
- Patent Title (中): 互连架构与堆叠柔性电缆
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Application No.: US13844501Application Date: 2013-03-15
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Publication No.: US09332643B2Publication Date: 2016-05-03
- Inventor: Sanka Ganesan , Timothy M. Swettlen , Gary B. Long , Donald T. Tran , Jill D. Murfin , David I. Amir
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes Davda & Victor LLP
- Agent Alan S Raynes
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/14 ; H05K3/36
Abstract:
Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.
Public/Granted literature
- US20140273552A1 INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE Public/Granted day:2014-09-18
Information query
