发明授权
- 专利标题： Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles
- 专利标题（中）： 使用绝缘线束制造高密度密封电馈通的方法
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申请号： US14118183申请日： 2012-05-16
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公开(公告)号： US09333337B2公开(公告)日： 2016-05-10
- 发明人: Kedar G. Shah , William J. Benett , Satinderpall S. Pannu
- 申请人： Kedar G. Shah , William J. Benett , Satinderpall S. Pannu
- 申请人地址： US CA Livermore
- 专利权人： Lawrence Livermore National Security, LLC
- 当前专利权人： Lawrence Livermore National Security, LLC
- 当前专利权人地址： US CA Livermore
- 代理商 James S. Tak
- 国际申请： PCT/US2012/038216 WO 20120516
- 国际公布： WO2012/158845 WO 20121122
- 主分类号： A61N1/05
- IPC分类号： A61N1/05 ; A61N1/375
摘要：
A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.
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