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1.发明授权公开(公告)号：US09333337B2
公开(公告)日：2016-05-10
申请号：US14118183
申请日：2012-05-16
CPC分类号： H01B17/303 , A61N1/05 , A61N1/3754 , H01B13/0036 , H01B13/06 , H02G3/22 , Y10T29/49194
摘要： A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.
摘要翻译： 一种使用电绝缘材料制造多根导电线的电馈通涂层的方法，并且以大致平行的布置将涂布的电线捆扎在一起。 捆扎的涂层线通过将相邻导线的电绝缘材料接合在一起而彼此固定，以形成整体块，然后横向于线切割以产生具有相对的第一和第二侧的块部分，多个导电馈通 在他们之间延伸。
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2.发明申请公开(公告)号：US20140144694A1
公开(公告)日：2014-05-29
申请号：US14118183
申请日：2012-05-16
IPC分类号： A61N1/05
CPC分类号： H01B17/303 , A61N1/05 , A61N1/3754 , H01B13/0036 , H01B13/06 , H02G3/22 , Y10T29/49194
摘要： A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.
摘要翻译： 一种使用电绝缘材料制造多根导电线的电馈通涂层的方法，并且以大致平行的布置将涂布的电线捆扎在一起。 捆扎的涂层线通过将相邻导线的电绝缘材料接合在一起而彼此固定，以形成整体块，然后横向于线切割以产生具有相对的第一和第二侧的块部分，多个导电馈通 在他们之间延伸。
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3.发明申请METHOD OF FABRICATING HIGH DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS USING INSULATED WIRE BUNDLES 审中-公开使用绝缘线束制作高密度电磁感应器的方法公开(公告)号：US20160254080A1
公开(公告)日：2016-09-01
申请号：US15147774
申请日：2016-05-05
CPC分类号： H01B17/303 , A61N1/05 , A61N1/3754 , H01B13/0036 , H01B13/06 , H02G3/22 , Y10T29/49194
摘要： A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.
摘要翻译： 一种使用电绝缘材料制造多根导电线的电馈通涂层的方法，并且以大致平行的布置将涂布的电线捆扎在一起。 捆扎的涂层线通过将相邻导线的电绝缘材料接合在一起而彼此固定，以形成整体块，然后横向于线切割以产生具有相对的第一和第二侧的块部分，多个导电馈通 在他们之间延伸。
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公开(公告)号：US09138571B2
公开(公告)日：2015-09-22
申请号：US13898418
申请日：2013-05-20
CPC分类号： A61M39/0247 , A61M2039/0261 , A61M2039/0267
摘要： A high density percutaneous chronic connector, having first and second connector structures each having an array of magnets surrounding a mounting cavity. A first electrical feedthrough array is seated in the mounting cavity of the first connector structure and a second electrical feedthrough array is seated in the mounting cavity of the second connector structure, with a feedthrough interconnect matrix positioned between a top side of the first electrical feedthrough array and a bottom side of the second electrical feedthrough array to electrically connect the first electrical feedthrough array to the second electrical feedthrough array. The two arrays of magnets are arranged to attract in a first angular position which connects the first and second connector structures together and electrically connects the percutaneously connected device to the external electronics, and to repel in a second angular position to facilitate removal of the second connector structure from the first connector structure.
摘要翻译： 具有第一和第二连接器结构的高密度经皮慢性连接器，每个连接结构具有包围安装腔的磁体阵列。 第一电馈通阵列位于第一连接器结构的安装空腔中，并且第二电馈通阵列位于第二连接器结构的安装空腔中，馈通互连矩阵位于第一电馈通阵列的顶侧之间 以及第二电馈通阵列的底侧，以将第一电馈通阵列电连接到第二电馈通阵列。 两个磁体阵列被布置成在第一角度位置上吸引，该第一角位置将第一和第二连接器结构连接在一起，并将经皮连接的装置电连接到外部电子装置，并且在第二角度位置排斥以便于移除第二连接器 结构从第一个连接器结构。
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公开(公告)号：US20170350034A1
公开(公告)日：2017-12-07
申请号：US15615648
申请日：2017-06-06
申请人： Anna Nikolaevna Ivanovskaya , Vanessa Tolosa , Dylan Dahlquist , Satinderpall S. Pannu , Kedar G. Shah , Angela C. Tooker , Fang Qian
发明人： Anna Nikolaevna Ivanovskaya , Vanessa Tolosa , Dylan Dahlquist , Satinderpall S. Pannu , Kedar G. Shah , Angela C. Tooker , Fang Qian
摘要： The present invention relates to surface roughening methods and more particularly to a method for electrochemical roughening of thin film macro- and micro-electrodes. In one embodiment, an electrochemical etch template is formed comprising polymer particles adsorbed on a surface of a substrate to be roughened, followed by electrochemically etching of exposed regions of the substrate between the polymer particles in the electrochemical etch template so as to selectively roughen the surface of the substrate. In another embodiment, a surface of the electrode is immersed in either a adsorbing acidic solution, such as sulfuric acid, or a non-adsorbing acidic solution, such as perchloric acid, followed by electrochemically pulse etching the surface of the substrate at a narrow frequency range for adsorbing acidic solutions, or at a wide frequency range for non-adsorbing acidic solutions.
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6.发明授权Hermetic electronics package with dual-sided electrical feedthrough configuration 有权具有双面电气馈通配置的密封电子封装公开(公告)号：US09504177B2
公开(公告)日：2016-11-22
申请号：US14118192
申请日：2012-06-14
IPC分类号： H05K1/03 , H05K5/06 , A61B5/00 , A61B5/04 , A61N1/375 , H02G3/00 , H05K3/46 , H05K5/02 , H01L23/00 , H01L23/498
CPC分类号： H05K5/069 , A61B5/04001 , A61B5/6861 , A61N1/3752 , H01L23/49827 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/12042 , H01L2924/19107 , H02G3/26 , H05K3/4644 , H05K5/0247 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.
摘要翻译： 密封电子组件包括具有相对的第一和第二开口端的金属壳体，每个端部连接到第一馈通构造和第二馈通构造。 每个馈通结构具有电绝缘基板和延伸穿过其中的导电馈通阵列，其中电绝缘基板分别连接到金属外壳的相对的第一和第二开放端，以便形成密封的外壳。 一组电子部件位于气密密封的外壳内，并且可操作地连接到第一和第二馈通结构的馈通，以便在封装的外侧与封装的相对侧电连通。
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公开(公告)号：US20140172051A1
公开(公告)日：2014-06-19
申请号：US13794579
申请日：2013-03-11
IPC分类号： A61N1/05
CPC分类号： A61N1/0551 , H05K1/118 , H05K3/4682 , H05K2201/0154 , H05K2203/016
摘要： A microelectrode array having one or more electrical conduits surrounded and insulated from each other by only a single layer of polymer (e.g. polyimide), and a method of fabricating the same. Multiple layers of an uncured polymer precursor (such as polyamic acid) are separately formed with metal layers sandwiched in between. Formation of the uncured polymer precursor layers includes deposition and heating to remove solvent only but not polymerize the precursor. Upon completing construction, the array is subjected to a high-temperature curing process that converts the uncured polymer precursor layers into the polymer. The different layers of the polymer precursor are thus covalently bonded together during the curing process to create a single continuous layer (e.g. monolithic block) of polymer, with no polymer-polymer interfaces.
摘要翻译： 具有一个或多个电导管的微电极阵列及其制造方法，该微电极阵列仅通过单层聚合物（例如聚酰亚胺）包围和绝缘。 未固化的聚合物前体（例如聚酰胺酸）的多层分别由夹在其间的金属层形成。 未固化的聚合物前体层的形成包括沉积和加热以除去溶剂，但不聚合前体。 在完成构造后，对阵列进行高温固化，将未固化的聚合物前体层转化成聚合物。 因此，聚合物前体的不同层在固化过程中共价键合在一起，以形成聚合物的单一连续层（例如整体嵌段），而没有聚合物 - 聚合物界面。
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公开(公告)号：US11214048B2
公开(公告)日：2022-01-04
申请号：US16285094
申请日：2019-02-25
摘要： A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and fills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.
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公开(公告)号：US20190322094A1
公开(公告)日：2019-10-24
申请号：US16285094
申请日：2019-02-25
摘要： A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and fills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.
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10.发明申请HERMETIC ELECTRONICS PACKAGE WITH DUAL-SIDED ELECTRICAL FEEDTHROUGH CONFIGURATION 有权具有双面电气充电配置的HERMETIC ELECTRONICS包装公开(公告)号：US20140347839A1
公开(公告)日：2014-11-27
申请号：US14118192
申请日：2012-06-14
CPC分类号： H05K5/069 , A61B5/04001 , A61B5/6861 , A61N1/3752 , H01L23/49827 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/12042 , H01L2924/19107 , H02G3/26 , H05K3/4644 , H05K5/0247 , Y10T29/49126 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.
摘要翻译： 密封电子组件包括具有相对的第一和第二开口端的金属壳体，每个端部连接到第一馈通构造和第二馈通构造。 每个馈通结构具有电绝缘基板和延伸穿过其中的导电馈通阵列，其中电绝缘基板分别连接到金属外壳的相对的第一和第二开放端，以便形成密封的外壳。 一组电子部件位于气密密封的外壳内，并且可操作地连接到第一和第二馈通结构的馈通，以便在封装的外侧与封装的相对侧电连通。
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