Invention Grant
- Patent Title: Electronics chassis and method of fabricating the same
- Patent Title (中): 电子底盘及其制造方法
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Application No.: US14135678Application Date: 2013-12-20
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Publication No.: US09333599B2Publication Date: 2016-05-10
- Inventor: Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
- Applicant: General Electric Company
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent John P. Darling
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B23P15/26 ; H05K9/00
Abstract:
An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Public/Granted literature
- US20150181763A1 ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-06-25
Information query
