CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME 有权
    电路卡组件及其制造方法

    公开(公告)号:US20150116940A1

    公开(公告)日:2015-04-30

    申请号:US14068697

    申请日:2013-10-31

    CPC classification number: H05K1/0203 H05K7/1461 H05K7/20672 Y10T29/49002

    Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

    Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板,安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架,使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架,以便于冷却电子部件。

    THERMAL INTERFACE DEVICES
    3.
    发明申请
    THERMAL INTERFACE DEVICES 有权
    热接口设备

    公开(公告)号:US20150282380A1

    公开(公告)日:2015-10-01

    申请号:US14225461

    申请日:2014-03-26

    Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.

    Abstract translation: 提供具有容纳结构和热导体的热接口装置。 此外,容纳结构包括至少一个壁,其中容纳结构构造成有助于热量的通过。 此外,热接口装置包括至少设置在容纳结构的一部分中的热导体。 此外,热导体构造成在固态和液态之间可逆地切换。 此外,热接口设备是可重新加工的设备。

    Circuit card assembly and method of fabricating the same
    8.
    发明授权
    Circuit card assembly and method of fabricating the same 有权
    电路卡组件及其制造方法

    公开(公告)号:US09253871B2

    公开(公告)日:2016-02-02

    申请号:US14068697

    申请日:2013-10-31

    CPC classification number: H05K1/0203 H05K7/1461 H05K7/20672 Y10T29/49002

    Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

    Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板,安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架,使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架,以便于冷却电子部件。

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