Invention Grant
US09333619B2 Adaptive endpoint method for pad life effect on chemical mechanical polishing
有权
化学机械抛光的垫寿命效应的自适应终点法
- Patent Title: Adaptive endpoint method for pad life effect on chemical mechanical polishing
- Patent Title (中): 化学机械抛光的垫寿命效应的自适应终点法
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Application No.: US13758658Application Date: 2013-02-04
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Publication No.: US09333619B2Publication Date: 2016-05-10
- Inventor: Chu-An Lee , Hui-Chi Huang , Peng-Chung Jangjian
- Applicant: Chu-An Lee , Hui-Chi Huang , Peng-Chung Jangjian
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/465
- IPC: H01L21/465 ; B24B37/20 ; B24B37/013 ; B24B49/12 ; H01J37/32 ; H01L21/66 ; H01L21/321
Abstract:
The present disclosure provides a chemical mechanical polishing (CMP) system. The CMP system includes a pad designed for wafer polishing, a motor driver coupled with the pad and designed to drive the pad during the wafer polishing, and a controller coupled with the motor driver and designed to control the motor driver. The CMP system further includes an in-situ rate monitor designed to collect polishing data from a wafer on the pad, determine CMP endpoint based on a life stage of the pad, and provide the CMP endpoint to the controller.
Public/Granted literature
- US20130146224A1 ADAPATIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL POLISHING Public/Granted day:2013-06-13
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