Invention Grant
US09333682B2 Stamp, method of fabricating the stamp, and imprint method using the same
有权
印章，制作印章的方法，以及使用印章的印记法
- Patent Title: Stamp, method of fabricating the stamp, and imprint method using the same
- Patent Title (中): 印章，制作印章的方法，以及使用印章的印记法
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Application No.: US13620219Application Date: 2012-09-14
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Publication No.: US09333682B2Publication Date: 2016-05-10
- Inventor: Ki-yeon Yang , Byung-kyu Lee , Du-hyun Lee , Woong Ko , Jae-kwan Kim
- Applicant: Ki-yeon Yang , Byung-kyu Lee , Du-hyun Lee , Woong Ko , Jae-kwan Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0006803 20120120
- Main IPC: B29C43/02
- IPC: B29C43/02 ; G03F7/00 ; B29C43/10 ; B82Y10/00 ; B82Y40/00 ; B29C43/32 ; B29C43/36
Abstract:
A stamp includes a transparent body having an inner chamber containing an inlet/outlet tube configured to have a fluid injected and removed therefrom.
Public/Granted literature
- US20130187309A1 STAMP, METHOD OF FABRICATING THE STAMP, AND IMPRINT METHOD USING THE SAME Public/Granted day:2013-07-25
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