Invention Grant
- Patent Title: Adhesive structure with hybrid adhesive layer
- Patent Title (中): 胶粘结构与混合胶层
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Application No.: US13928268Application Date: 2013-06-26
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Publication No.: US09333725B2Publication Date: 2016-05-10
- Inventor: Meng-Ying Chuang , Kuo-Feng Chen , Chih-Chia Chang , Chen-Pang Kung
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Main IPC: B32B7/14
- IPC: B32B7/14 ; B32B7/02 ; C09J5/06
Abstract:
An adhesive structure is disclosed. The adhesive structure includes a first layer, a second layer, and a hybrid adhesive layer for adhering the first layer to the second layer. The hybrid adhesive layer includes two or more adhesive units made of different adhesive materials, and the two or more adhesive units are arranged in a planar pattern.
Public/Granted literature
- US20150004345A1 Adhesive Structure With Hybrid Adhesive Layer Public/Granted day:2015-01-01
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