Invention Grant
- Patent Title: Deformation sensor package and method
- Patent Title (中): 变形传感器封装及方法
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Application No.: US14071131Application Date: 2013-11-04
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Publication No.: US09335225B2Publication Date: 2016-05-10
- Inventor: Han Xu , Anthony S. Chu , Barry A. Singer
- Applicant: Measurement Specialties, Inc.
- Applicant Address: US VA Hampton
- Assignee: Measurement Specialties, Inc.
- Current Assignee: Measurement Specialties, Inc.
- Current Assignee Address: US VA Hampton
- Agency: Howard IP Law Group
- Main IPC: G01L1/00
- IPC: G01L1/00 ; G09B23/32 ; G01B5/30 ; G01L5/00

Abstract:
A deformation sensor package includes a housing having a base and a peripheral wall extending from the base. The base and peripheral wall define two cavities each configured to receive a potentiometer, such as a string potentiometer. The peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing. Each aperture is configured to allow for the passage of a moveable sensing end of an associated potentiometer therethrough.
Public/Granted literature
- US20150122043A1 DEFORMATION SENSOR PACKAGE AND METHOD Public/Granted day:2015-05-07
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