Invention Grant
US09335225B2 Deformation sensor package and method 有权
变形传感器封装及方法

Deformation sensor package and method
Abstract:
A deformation sensor package includes a housing having a base and a peripheral wall extending from the base. The base and peripheral wall define two cavities each configured to receive a potentiometer, such as a string potentiometer. The peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing. Each aperture is configured to allow for the passage of a moveable sensing end of an associated potentiometer therethrough.
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