Invention Grant
- Patent Title: Method of forming layout design
- Patent Title (中): 形成布局设计的方法
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Application No.: US14484588Application Date: 2014-09-12
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Publication No.: US09336348B2Publication Date: 2016-05-10
- Inventor: Tung-Heng Hsieh , Chung-Te Lin , Sheng-Hsiung Wang , Hui-Zhong Zhuang , Min-Hsiung Chiang , Ting-Wei Chiang , Li-Chun Tien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of forming a layout design for fabricating an integrated circuit (IC) is disclosed. The method includes identifying one or more areas in the layout design occupied by one or more segments of a plurality of gate structure layout patterns of the layout design; and generating a set of layout patterns overlapping the identified one or more areas. The plurality of gate structure layout patterns has a predetermined pitch smaller than a spatial resolution of a predetermined lithographic technology. A first layout pattern of the set of layout patterns has a width less than twice the predetermined pitch.
Public/Granted literature
- US20160078164A1 METHOD OF FORMING LAYOUT DESIGN Public/Granted day:2016-03-17
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