Invention Grant
- Patent Title: Transferring heat through an optical layer of integrated circuitry
- Patent Title (中): 通过集成电路的光学层传输热量
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Application No.: US14633069Application Date: 2015-02-26
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Publication No.: US09337122B2Publication Date: 2016-05-10
- Inventor: Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Cayman House
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Cayman House
- Agency: Scully Scott Murphy and Presser
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H01L23/367 ; G02B6/42 ; G02B6/43 ; G02B6/122 ; G06F17/50

Abstract:
A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.
Public/Granted literature
- US20150221575A1 TRANSFERRING HEAT THROUGH AN OPTICAL LAYER OF INTEGRATED CIRCUITRY Public/Granted day:2015-08-06
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