公开(公告)号：US10091909B2

公开(公告)日：2018-10-02

申请号：US14632180

申请日：2015-02-26

Applicant: GLOBALFOUNDRIES INC.

Inventor： Thomas J. Brunschwiler ,  Urs Kloter ,  Ryan Joseph Linderman ,  Bruno Michel ,  Hugo E. Rothuizen ,  Reio Waelchli

IPC: H05K7/20 ,  H01L23/427 ,  H01L23/473 ,  H01L23/34 ,  F28D1/04 ,  G06F1/20

Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).

公开(公告)号：US09398730B2

公开(公告)日：2016-07-19

申请号：US14287249

申请日：2014-05-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Mircea Gusat ,  Bruno Michel ,  Thomas E Morf ,  Sebastien Ragot ,  Maria Soimu

IPC: H05K7/20 ,  H04B10/25

CPC classification number: H05K7/20772 ,  H04B10/25

Abstract: An electronic circuit device, including a combined optical transmission and cooling fluid conduit network. The network includes at least one cooling conduit having an optical transmission medium. The network is configured to convey a cooling fluid via the at least one cooling conduit and to convey an electromagnetic signal via the optical transmission medium. The network is in thermal communication with a first set of one or more components of the electronic circuit device and in signal communication with a second set of one or more components of the electronic circuit device. The first set and second set of components are at least partly overlapping. A method for conveying optical signal in such an electronic circuit device is also provided.

Abstract translation: 一种电子电路装置，包括组合的光传输和冷却流体导管网络。 网络包括至少一个具有光传输介质的冷却管道。 网络被配置为经由至少一个冷却导管传送冷却流体并且经由光传输介质传送电磁信号。 网络与电子电路设备的第一组一个或多个组件进行热通信，并且与电子电路设备的一个或多个组件的第二组信号通信。 第一组和第二组件至少部分重叠。 还提供了一种在这种电子电路装置中传送光信号的方法。

公开(公告)号：US09337122B2

公开(公告)日：2016-05-10

申请号：US14633069

申请日：2015-02-26

Applicant: GLOBALFOUNDRIES INC.

Inventor： Harry Barowski ,  Thomas Brunschwiler ,  Roger F. Dangel ,  Hubert Harrer ,  Andreas Huber ,  Norbert M. Meier ,  Bruno Michel ,  Tim Niggemeier ,  Stephan Paredes ,  Jochen Supper ,  Jonas R. Weiss

IPC: G02B6/12 ,  H01L23/367 ,  G02B6/42 ,  G02B6/43 ,  G02B6/122 ,  G06F17/50

CPC classification number: H01L23/367 ,  G02B6/12 ,  G02B6/122 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/43 ,  G02B2006/12147 ,  G06F17/5022 ,  G06F17/5068 ,  G06F17/5077 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract translation: 一种用于产生集成电路结构的功能设计模型的计算机辅助设计系统中的计算机程序产品或硬件描述语言（“HDL”）设计结构，包括生成集成电路结构的至少第一和第二区域的功能性表示 产生包括光波导的光学层的功能表示，以及产生用于将热量从至少第二区域通过光学层传递到散热器的导热材料的功能表示。

公开(公告)号：US10278306B2

公开(公告)日：2019-04-30

申请号：US14632194

申请日：2015-02-26

Applicant: GLOBALFOUNDRIES INC.

Inventor： Thomas J. Brunschwiler ,  Urs Kloter ,  Ryan Joseph Linderman ,  Bruno Michel ,  Hugo E. Rothuizen ,  Reto Waelchli

IPC: F28D1/04 ,  H05K7/20 ,  H01L23/427 ,  H01L23/473 ,  H01L23/34 ,  G06F1/20

Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).