Invention Grant
- Patent Title: Semiconductor component with moisture barrier for sealing semiconductor body
- Patent Title (中): 半导体元件具有防潮密封半导体体
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Application No.: US14207777Application Date: 2014-03-13
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Publication No.: US09337155B2Publication Date: 2016-05-10
- Inventor: Gottfried Beer , Juergen Hoegerl , Thilo Stolze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102013205138 20130322
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L25/07 ; H01L23/00 ; H01L23/29 ; H01L25/00 ; H01L29/16 ; H01L21/56
Abstract:
A semiconductor component includes a semiconductor body having a top side and a bottom side opposite the top side. A top metallization is applied to the top side and a bottom metallization is applied to the bottom side. A moisture barrier completely seals the semiconductor body in cooperation with the top metallization and the bottom metallization.
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