Invention Grant
- Patent Title: Multi-layered phase-change memory device
- Patent Title (中): 多层相变存储器件
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Application No.: US13874411Application Date: 2013-04-30
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Publication No.: US09337421B2Publication Date: 2016-05-10
- Inventor: Tsung-Shune Chin , Chih-Chung Chang , Yung-Ching Chu
- Applicant: FENG CHIA UNIVERSITY
- Applicant Address: TW Taichung
- Assignee: FENG CHIA UNIVERSITY
- Current Assignee: FENG CHIA UNIVERSITY
- Current Assignee Address: TW Taichung
- Agent Cheng-Ju Chiang
- Priority: TW101116245A 20120507
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
The present invention relates to a phase-change memory device structure and the materials used. The structure comprises a substrate, a single or multiple sandwich-memory-unit(s), a first electrode, and a second electrode. The sandwich-memory-unit contains an upper barrier layer, a lower barrier layer, and a memory layer therebetween. The thickness of the memory-layer is less than 30 nm. The present invention provides a phase-change memory device with a high Tc and a low volume changing rate during phase-change.
Public/Granted literature
- US20130292631A1 Multi-Layered Phase-Change Memory Device Public/Granted day:2013-11-07
Information query
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