Invention Grant
- Patent Title: Induction activated thermal bonding
- Patent Title (中): 感应激活热粘合
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Application No.: US13889225Application Date: 2013-05-07
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Publication No.: US09338832B2Publication Date: 2016-05-10
- Inventor: Derek W. Wright , Erik A. Uttermann , Stephen R. McClure
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: H05B6/10
- IPC: H05B6/10 ; H05B6/14
Abstract:
The described embodiment relates generally to the field of inductive heating. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a radio-frequency (RF) receiver structure are disclosed for the purpose of completing an inductive bonding process without causing harm to adjacent electrical components.
Public/Granted literature
- US20140117006A1 INDUCTION ACTIVATED THERMAL BONDING Public/Granted day:2014-05-01
Information query
