Invention Grant
- Patent Title: Wired circuit board
- Patent Title (中): 有线电路板
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Application No.: US13826096Application Date: 2013-03-14
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Publication No.: US09338888B2Publication Date: 2016-05-10
- Inventor: Saori Kanezaki , Hitoki Kanagawa , Yoshito Fujimura
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2012-067717 20120323
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/18 ; H05K1/11 ; G11B5/55 ; H05K1/05 ; H05K3/32 ; G11B5/48
Abstract:
A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The terminal includes a first contact portion, and a second contact portion provided around the first contact portion to protrude more than the first contact portion toward one side in the thickness direction.
Public/Granted literature
- US20130248233A1 WIRED CIRCUIT BOARD Public/Granted day:2013-09-26
Information query
