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    Suspension board with circuit
    1.
    发明授权
    Suspension board with circuit 有权
    悬挂板带电路

    公开(公告)号：US09502058B2

    公开(公告)日：2016-11-22

    申请号：US14878319

    申请日：2015-10-08

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito Fujimura ,  Hiroyuki Tanabe ,  Saori Kanezaki ,  Naohiro Terada ,  Yuu Sugimoto

    IPC: G11B5/48

    CPC classification number: G11B5/4853 ,  G11B5/4826 ,  G11B5/484

    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.

    Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。

    Method of producing a wired circuit board
    3.
    发明授权
    Method of producing a wired circuit board 有权
    生产有线电路板的方法

    公开(公告)号：US09167693B2

    公开(公告)日：2015-10-20

    申请号：US14086445

    申请日：2013-11-21

    Applicant: NITTO DENKO CORPORATION

    Inventor： Tomoaki Okuno ,  Saori Kanezaki ,  Tsuyoshi Oguro ,  Takeshi Kawakami

    IPC: H05K3/02 ,  H05K1/11 ,  H05K1/05 ,  G11B5/48

    CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0281 ,  H05K1/05 ,  H05K1/056 ,  H05K1/09 ,  H05K1/117 ,  H05K2201/0154 ,  H05K2201/0394 ,  Y10T29/49155

    Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

    Abstract translation: 制造布线电路基板的方法包括：制备金属支撑层的第一步骤，在金属支撑层的厚度方向的一侧上形成具有第一开口的绝缘层和多个第一开口的第二步骤 的第三步骤，在所述绝缘层的厚度方向的一侧形成具有多个端子部分的导电层，所述多个端子部分对应于所述多个端子形成部分，第四步骤，部分地去除所述金属 支撑层以形成第二开口和设置在所述多个端子形成部之间的至少一个加强金属支撑部，以及第五步骤，去除从所述第二开口露出的所述多个端子形成部，以暴露所述多个端子形成部的两个侧表面 端子部分在厚度方向上。

    Suspension board with circuit and producing method thereof
    4.
    发明授权
    Suspension board with circuit and producing method thereof 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：US09521745B2

    公开(公告)日：2016-12-13

    申请号：US15054391

    申请日：2016-02-26

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito Fujimura ,  Saori Kanezaki ,  Naohiro Terada

    IPC: G11B5/48 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46 ,  H05K1/05

    CPC classification number: G11B5/4846

    Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion, a base insulating layer disposed at one side of the metal supporting board, and a conductive layer disposed at one side of the base insulating layer and including a plurality of terminal portions overlapped with the support opening portion and disposed at spaced intervals to each other. The base insulating layer includes a plurality of base opening portions that are disposed between the plurality of terminal portions in an arrangement direction, a plurality of thick portions that are overlapped with each of end portions of the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement direction, and a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality of thick portions and are thinner than the plurality of thick portions.

    Abstract translation: 具有电路的悬挂板包括具有支撑开口部分的金属支撑板，设置在金属支撑板一侧的基底绝缘层和设置在基底绝缘层一侧的导电层，并且包括多个端子部分 与支撑开口部分重叠并且以彼此间隔开的间隔设置。 基底绝缘层包括多个基部开口部，其设置在排列方向上的多个端子部之间，多个厚部与多个端子部的各端部在与两个正交的方向上重叠 厚度方向和排列方向的方向以及多个基部开口部的沿着多个厚壁部的边缘部配置的多个薄壁部，并且比多个厚部更薄。

    Suspension board with circuit
    5.
    发明授权
    Suspension board with circuit 有权
    悬挂板带电路

    公开(公告)号：US09418687B2

    公开(公告)日：2016-08-16

    申请号：US14936102

    申请日：2015-11-09

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naohiro Terada ,  Yoshito Fujimura ,  Hiroyuki Tanabe ,  Saori Kanezaki ,  Yuu Sugimoto

    IPC: G11B5/40 ,  G11B5/48

    CPC classification number: G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486

    Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.

    Abstract translation: 具有电路的悬挂板包括：滑块安装区域，其构造成在其上安装滑块;基座部，设置在滑块安装区域中并构造成支撑滑块;以及阻挡部，其设置在滑块安装区域中并且构造成防止粘合固定 滑块从滑块安装区域流出。 基座部的厚度比坝部的厚度厚。

    Suspension board with circuit
    7.
    发明授权
    Suspension board with circuit 有权

    公开(公告)号：US09865288B2

    公开(公告)日：2018-01-09

    申请号：US15040199

    申请日：2016-02-10

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naohiro Terada ,  Saori Kanezaki ,  Hiroyuki Tanabe ,  Yoshito Fujimura

    IPC: G11B15/48 ,  H05K1/05 ,  G11B5/48 ,  H05K3/30

    CPC classification number: G11B5/4853 ,  G06F1/184 ,  G11B5/4826 ,  G11B5/4873 ,  H05K1/056 ,  H05K3/305 ,  Y02P70/613

    Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

    Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof
    8.
    发明授权
    Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof 有权
    有线电路板，包括形成有填充有导电部分的开口的绝缘层及其制造方法

    公开(公告)号：US09018540B2

    公开(公告)日：2015-04-28

    申请号：US13889839

    申请日：2013-05-08

    Applicant: Nitto Denko Corporation

    Inventor： Jun Ishii ,  Saori Kanezaki

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K1/05 ,  H05K3/32

    CPC classification number: H05K1/0298 ,  G11B5/484 ,  G11B5/4873 ,  H05K1/053 ,  H05K1/111 ,  H05K3/321 ,  H05K3/42 ,  H05K2201/09745 ,  H05K2201/10083 ,  Y02P70/611

    Abstract: A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.

    Abstract translation: 布线电路板包括：绝缘层，形成有沿着布线电路板的厚度方向延伸穿过的开口;导电层，形成在绝缘层的厚度方向的一个表面上，并且包括单面端子部， 形成在绝缘层的厚度方向的另一个表面上的另一侧端子部分，当沿着厚度方向突出时设置成与开口和单侧端子部分重叠，并且用于连接到电子元件 通过导电粘合剂和填充该开口的导电部分，以在一侧端子部分和另一侧端子部分之间提供导电。

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