Invention Grant
- Patent Title: Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure
- Patent Title (中): 制造安装有单片陶瓷电容器的安装基板的制造方法和安装结构
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Application No.: US14050842Application Date: 2013-10-10
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Publication No.: US09338889B2Publication Date: 2016-05-10
- Inventor: Kazuo Hattori , Isamu Fujimoto , Norio Shiroiwa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-231700 20121019; JP2013-134914 20130627
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30 ; H01G4/30 ; H05K1/11 ; H05K3/34 ; H01G2/06 ; H01G4/232

Abstract:
A method of manufacturing a mounting substrate in which a pair of monolithic ceramic capacitors each of which includes a multilayer body in which a plurality of dielectric ceramic sheets and a plurality of substantially planar inner electrodes are stacked on top of one another and at least a pair of outer electrodes electrically connected to the inner electrodes and provided on a surface of the multilayer body are mounted on a circuit board includes a process of joining the outer electrodes to lands formed on the front rear surfaces of the circuit board, the lands formed on the front surface being formed at positions that are plane-symmetrical to positions of the corresponding lands formed on the rear surface while being electrically connected to the corresponding lands formed on the rear surface, such that surface directions of planes of the inner electrodes match each other.
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