Invention Grant
- Patent Title: Electronic devices with reflective chamfer surfaces
- Patent Title (中): 具有反光倒角表面的电子设备
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Application No.: US14620092Application Date: 2015-02-11
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Publication No.: US09338908B2Publication Date: 2016-05-10
- Inventor: Napthaneal Y. Tan , Lucy Elizabeth Browning
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H04M1/02 ; B23C5/00 ; H05K5/04 ; B23P11/00 ; B23P17/00 ; G03F1/38 ; H01Q1/24 ; H05K13/00 ; C25D11/02 ; C25D7/00 ; C25D11/12 ; H05K5/03 ; H01Q1/42 ; C25D11/34 ; B23C5/10 ; B23P17/02 ; H04M1/11 ; C25D11/24

Abstract:
The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface thereon. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter is used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. The diamond cutter has a cutting edge and a land. The cutting edge cuts the surface of the part and the land burnishes the surface of the part to form a highly reflective and smooth surface. Thus, the diamond cutter cuts and burnishes portions of the part, thereby eliminating a subsequent polishing step.
Public/Granted literature
- US20150196981A1 METHODS FOR CUTTING SMOOTH REFLECTIVE SURFACES Public/Granted day:2015-07-16
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