Invention Grant
- Patent Title: Shielding reinforcing apparatus
- Patent Title (中): 屏蔽加强装置
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Application No.: US14260708Application Date: 2014-04-24
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Publication No.: US09338930B2Publication Date: 2016-05-10
- Inventor: Won-Jea Jang , Dong-In Ha , Jin-Young Kwak , Gi-Heung Kim , Jung-Yoon Seo , Jae-Joon Yoo , Byoung-Hee Lee , Sung-Jin Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2013-0046138 20130425
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
A shield reinforcing apparatus is provided. The shield reinforcing apparatus includes a printed circuit board, a shield member that covers the printed circuit board, and at least one shield reinforcing part provided in the printed circuit board and configured to contact the shield member to be pressed.
Public/Granted literature
- US20140318851A1 SHIELDING REINFORCING APPARATUS Public/Granted day:2014-10-30
Information query
