Invention Grant
- Patent Title: Honeycomb structure and manufacturing method thereof
- Patent Title (中): 蜂窝结构及其制造方法
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Application No.: US14221825Application Date: 2014-03-21
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Publication No.: US09339799B2Publication Date: 2016-05-17
- Inventor: Yoshio Kikuchi , Hiroharu Kobayashi , Kenichi Hidaka , Miyuki Kojima , Yoshimasa Kobayashi
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2013-075063 20130329
- Main IPC: B01J27/224
- IPC: B01J27/224 ; C04B37/00 ; C04B38/00 ; C04B35/565 ; B01D46/24 ; F01N3/20

Abstract:
To provide a honeycomb structure capable of using as a catalyst carrier, which functions as a heater, and where a bonding layer is hard to break and an electrical resistance value is hard to rise; including a honeycomb segment bonded body where honeycomb segments are bonded by bonding layer, and a pair of electrode members disposed on a side surface of the bonded body, the electrode members is formed into a band shape, and in a cross section perpendicular to the cell extending direction, one electrode member is disposed on an opposite side across the center of the bonded body to another electrode member, and in at least a part of the bonding layer, inorganic fibers made of β-SiC and a metal silicide are included in a porous body where silicon carbide are bound with silicon in a state where pores are held among the particles.
Public/Granted literature
- US20140296055A1 HONEYCOMB STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-10-02
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