Invention Grant
- Patent Title: Methods of making inkjet print heads using a sacrificial substrate layer
- Patent Title (中): 使用牺牲基底层制造喷墨打印头的方法
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Application No.: US13906447Application Date: 2013-05-31
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Publication No.: US09340023B2Publication Date: 2016-05-17
- Inventor: Paul I. Mikulan , Kenneth J. Stewart , Virgina L. Hwang
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: US TX Coppell
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: B41J2/16
- IPC: B41J2/16

Abstract:
A method of making inkjet print heads may include forming a first wafer including a sacrificial substrate layer, and a first dielectric layer thereon having first openings therein defining inkjet orifices. The method may also include forming a second wafer having inkjet chambers defined thereon, and joining the first and second wafers together so that each inkjet orifice is aligned with a respective inkjet chamber. The method may further include removing the sacrificial substrate layer thereby defining the inkjet print heads.
Public/Granted literature
- US20140356990A1 METHODS OF MAKING INKJET PRINT HEADS USING A SACRIFICIAL SUBSTRATE LAYER Public/Granted day:2014-12-04
Information query
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