发明授权
- 专利标题： Pick-up method of die bonder and die bonder
- 专利标题（中）： 贴片机和芯片焊接机的拾取方法
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申请号： US13224366申请日： 2011-09-02
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公开(公告)号： US09343338B2公开(公告)日： 2016-05-17
- 发明人: Naoki Okamoto , Keita Yamamoto
- 申请人： Naoki Okamoto , Keita Yamamoto
- 申请人地址： JP Minami-Alps
- 专利权人： Fasford Technology Co., Ltd.
- 当前专利权人： Fasford Technology Co., Ltd.
- 当前专利权人地址： JP Minami-Alps
- 代理机构： Crowell & Moring LLP
- 优先权： JP2011-063532 20110323
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; B32B38/10 ; H01L21/67
摘要：
When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film.
公开/授权文献
- US20120244647A1 Pick-Up Method of Die Bonder and Die Bonder 公开/授权日：2012-09-27