Invention Grant
- Patent Title: Manufacturing method of thin film transistor substrate
- Patent Title (中): 薄膜晶体管衬底的制造方法
-
Application No.: US14675973Application Date: 2015-04-01
-
Publication No.: US09343582B2Publication Date: 2016-05-17
- Inventor: Kuan-Feng Lee
- Applicant: INNOCOM TECHNOLOGY(SHENZHEN) CO., LTD. , InnoLux Corporation
- Applicant Address: CN Longhua Town, Guangdong Province TW Miao-Li County
- Assignee: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD.,INNOLUX CORPORATION
- Current Assignee: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD.,INNOLUX CORPORATION
- Current Assignee Address: CN Longhua Town, Guangdong Province TW Miao-Li County
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW100147908A 20111222
- Main IPC: H01L31/20
- IPC: H01L31/20 ; H01L29/04 ; H01L29/786 ; H01L29/66 ; H01L21/027

Abstract:
An embodiment of the invention provides a manufacturing method of a thin film transistor substrate including: sequentially forming a gate electrode, a gate insulating layer covering the gate electrode, an active material layer, and a photo-sensitive material layer on a first substrate; performing a photolithography process by using a half tone mask to form a photo-sensitive protective layer which is above the gate electrode and has a first recess and a second recess; etching the active material layer by using the photo-sensitive protective layer as a mask to form an active layer; removing a portion of the photo-sensitive protective layer at bottoms of the first recess and the second recess to expose a first portion and a second portion of the active layer respectively; forming a first electrode connecting to the first portion; and forming a second electrode connecting to the second portion.
Public/Granted literature
- US20150206980A1 MANUFACTURING METHOD OF THIN FILM TRANSISTOR SUBSTRATE Public/Granted day:2015-07-23
Information query
IPC分类: