Invention Grant
- Patent Title: Heating phase change material
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Application No.: US14167122Application Date: 2014-01-29
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Publication No.: US09343676B2Publication Date: 2016-05-17
- Inventor: Guy C. Wicker , Fabio Pellizzer , Enrico Varesi , Agostino Pirovano
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H01L45/00
- IPC: H01L45/00 ; G11C13/00 ; H01L27/24

Abstract:
A phase change memory may be formed of two vertically spaced layers of phase change material. An intervening dielectric may space the layers from one another along a substantial portion of their lateral extent. An opening may be provided in the intervening dielectric to allow the phase change layers to approach one another more closely. As a result, current density may be increased at this location, producing heating.
Public/Granted literature
- US20140147965A1 HEATING PHASE CHANGE MATERIAL Public/Granted day:2014-05-29
Information query
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