The disclosure describes an exemplary binding layer formed on Aluminum (Al) substrate that binds the substrate with a coated material. Additionally, an extended form of the binding layer is described. By making a solution containing Al-transition metal elements-P—O, the solution can be used in slurry making (the slurry contains active materials) in certain embodiments. The slurry can be coated on Al substrate followed by heat treatment to form a novel electrode. Alternatively, in certain embodiments, the solution containing Al-transition metal elements-P—O can be mixed with active material powder, after heat treatment, to form new powder particles bound by the binder.