Invention Grant
US09346925B2 Epoxy resin blend dispersion and a process for preparing the dispersion
有权
环氧树脂共混物分散体和制备分散体的方法
- Patent Title: Epoxy resin blend dispersion and a process for preparing the dispersion
- Patent Title (中): 环氧树脂共混物分散体和制备分散体的方法
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Application No.: US14408106Application Date: 2013-06-24
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Publication No.: US09346925B2Publication Date: 2016-05-24
- Inventor: Liang Chen , Liang Hong
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agent Andrew E.C. Merriam
- International Application: PCT/US2013/047275 WO 20130624
- International Announcement: WO2014/004358 WO 20140103
- Main IPC: C09D163/00
- IPC: C09D163/00 ; C09D5/02 ; C08L63/00 ; C08J3/05 ; C04B26/14 ; C08J3/03 ; C09D7/02 ; C09D7/12 ; C04B24/28 ; C08K5/41 ; C04B28/02 ; C04B40/00 ; B32B27/38 ; C04B111/00 ; C04B111/20 ; C04B111/27
Abstract:
The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifically, the process is a solvent free melt kneading or shearing dispersion process wherein the dispersion is processed at from 50 to 150° C., and the resulting dispersion is stable.
Public/Granted literature
- US20150105492A1 EPOXY RESIN BLEND DISPERSION AND A PROCESS FOR PREPARING THE DISPERSION Public/Granted day:2015-04-16
Information query
IPC分类:
