Invention Grant
- Patent Title: Apparatus for measurement of three-dimensional shape
- Patent Title (中): 三维形状测量装置
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Application No.: US14169324Application Date: 2014-01-31
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Publication No.: US09347772B2Publication Date: 2016-05-24
- Inventor: Dae Seo Park , Dae Gwan Kim , Won Soo Ji , Choo Ho Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0030306 20130321
- Main IPC: G01B11/25
- IPC: G01B11/25

Abstract:
An apparatus for measurement of a three-dimensional (3D) shape includes a lens unit transmitting slit beams to a plurality of measurement objects, a light source unit irradiating the plurality of slit beams to the lens unit at different angles, an imaging unit obtaining images of the plurality of measurement objects formed by the slit beams irradiated on the plurality of measurement objects, and a calculation processing unit generating information regarding a 3D shape of the plurality of measurement objects from the images obtained by the imaging unit.
Public/Granted literature
- US20140285815A1 APPARATUS FOR MEASUREMENT OF THREE-DIMENSIONAL SHAPE Public/Granted day:2014-09-25
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