Invention Grant
- Patent Title: Stackable semiconductor package and manufacturing method thereof
- Patent Title (中): 可堆叠半导体封装及其制造方法
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Application No.: US13776567Application Date: 2013-02-25
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Publication No.: US09349611B2Publication Date: 2016-05-24
- Inventor: Chia-Ching Chen , Yi-Chuan Ding
- Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu; Angela D. Murch
- Priority: TW99108423A 20100322
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/538 ; H01L25/10 ; H01L25/16 ; H01L21/56 ; H01L23/29 ; H01L23/00 ; H01L25/00
Abstract:
A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, an undesirable deformation resulting from high temperatures can be controlled or reduced.
Public/Granted literature
- US20130171774A1 STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-07-04
Information query
IPC分类:
