Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
-
Application No.: US14504319Application Date: 2014-10-01
-
Publication No.: US09349710B2Publication Date: 2016-05-24
- Inventor: Chien-Hui Chen , Tsang-Yu Liu , Chun-Wei Chang , Chia-Ming Cheng
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L25/065 ; H01L21/683 ; H01L23/00
Abstract:
A method for forming a chip package is provided. A first substrate is provided. A second substrate is attached on the first substrate, wherein the second substrate has a plurality of rectangular chip regions separated by a scribed-line region. A portion of the second substrate corresponding to the scribed-line region is removed to form a plurality of chips on the first substrate, wherein at least one bridge portion is formed between adjacent chips. A chip package formed by the method is also provided.
Public/Granted literature
- US20150097299A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2015-04-09
Information query
IPC分类:
