Invention Grant
- Patent Title: Layer arrangement
- Patent Title (中): 层布置
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Application No.: US14287222Application Date: 2014-05-27
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Publication No.: US09349794B2Publication Date: 2016-05-24
- Inventor: Gopalakrishnan Trichy Rengarajan , Christian Fachmann
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/285 ; H01L21/74 ; H01L21/308 ; H01L21/768
Abstract:
A layer arrangement in accordance with various embodiments may include: a first layer having a side; one or more nanoholes in the first layer that are open towards the side of the first layer; a second layer filling at least part of the nanoholes and covering at least part of the side of the first layer, the second layer including at least one of the following materials: a metal or metal alloy, a glass material, a polymer material, a ceramic material.
Public/Granted literature
- US20140264764A1 LAYER ARRANGEMENT Public/Granted day:2014-09-18
Information query
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