Invention Grant
- Patent Title: Mold structure
- Patent Title (中): 模具结构
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Application No.: US14790059Application Date: 2015-07-02
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Publication No.: US09350132B2Publication Date: 2016-05-24
- Inventor: Shinya Onoda
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-135161 20100614
- Main IPC: B29C45/03
- IPC: B29C45/03 ; H01R43/24 ; H01R25/14 ; H01H69/02 ; H01H85/045 ; H01H85/10 ; H01R13/11 ; H01H85/04 ; H01R43/16 ; B29C45/14 ; B29C45/04 ; H01H85/02 ; B29L31/36 ; B29L31/34
Abstract:
A fixed mold and a movable mold as joined together are configured to nip a terminal base of a tuning-fork terminal between a terminal base receiving portion and a terminal base abut portion with the tuning-fork terminal being protruded outside a cavity of the fixed mold.
Public/Granted literature
- US20150303637A1 MOLD STRUCTURE Public/Granted day:2015-10-22
Information query
